Power Module Package Structure Capable of Surviving Greater ΔTj Thermal Cycles
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Materials Science Forum
سال: 2013
ISSN: 1662-9752
DOI: 10.4028/www.scientific.net/msf.740-742.1040